ASI 388 Clear Electronic Grade Silicone

Surface Preparation All surfaces should be clean and dry. It is recommended that bonding surfaces be solvent wiped with oil-free solvents, such as xylol, toluol naphtha or non-flammable chlorinated solvents. Do not wipe with oil-based solvents such as Varsol. Allow surface to dry thoroughly before applying sealant. Directions This electronic grade silicone is ready to use and requires no mixing or additives. The cure mechanism begins as soon as the sealant comes in contact with the air. At conditions of 25 C (77° F) and 50% relative humidity, the sealant will skin in 15 minutes and fully cure within 48 hours (1/8 bead). Higher humidity accelerates cure. Tooling should be done before skinning takes place. In applications where partial total confinement of sealant is prevalent, the time required for proper cure is lengthened by the degree of confinement. Priming Priming of the electronic grade silicone is normally not required for application to most substrates. Unprimed adhesion can be readily tested by applying a small trial bead and allowing 7 days for maximum adhesion to occur.

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